Secure Integrated Circuit with Physical Attack Detection based on Reconfigurable Top Metal Shield

  • Mun, Yeongjin
  • Kim, Hyungseup
  • Lee, Byeoncheol
  • Han, Kwonsang
  • Kim, Jaesung
  • ... CHOI, BYONG DEOK
  • 외 3명
Citations

WEB OF SCIENCE

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Citations

SCOPUS

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초록

Invasive physical attacks on integrated circuits (ICs), such as de-packaging, focused ion beam (FIB) chip editing, and micro-probing attempts, constitute security threats for chips with potentially valuable information, such as smart cards. Using a state-of-the-art circuit-editing technique, an attacker can remove an IC's top metal layer, leaving its secure information exposed to micro-probing attacks. Security ICs can be seriously threatened by such attacks and thus require on-chip countermeasures. Conventional active shields, however, have difficulty coping with physical attacks based on FIB chip editing (i.e., bypassing the top metal shield). This study presents a novel countermeasure against physical attacks based on the use of a reconfigurable metal shield for both top metal removal and micro-probing attack detection. This shield consists of two circuits: an FIB chip editing detection circuit consisting of a random number generator and a micro-probing attempt detection circuit consisting of two conditionally synchronized ring oscillators. Both circuits share a randomly reconfigured top metal shield, which represents a promising solution for security against state-of-the-art invasive attacks.

키워드

Terms-Active shieldhardware securityinvasive attackmicro-probing attempttop metal shieldChip scale packagesDetector circuitsHardware securityIntegrated circuitsIon beamsMetalsNumber theoryRandom number generationReconfigurable hardwareSmart cardsTiming circuitsActive shieldsAttack detectionDetection circuitsIntegrated circuits (ICs)Invasive attackMicro-probing attemptRandom number generatorsSecurity threatsOscillators (electronic)
제목
Secure Integrated Circuit with Physical Attack Detection based on Reconfigurable Top Metal Shield
저자
Mun, YeongjinKim, HyungseupLee, ByeoncheolHan, KwonsangKim, JaesungKim, Ji-HoonCHOI, BYONG DEOKKim, Dong KyueKo, Hyoungho
DOI
10.5573/JSTS.2019.19.3.260
발행일
2019-06
유형
Article
저널명
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE
19
3
페이지
260 ~ 269