Autonomous high-speed serial link power management depending on required link performance for HMC

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초록

Many studies on 3D-stacked dynamic RAMs (DRAMs) have been conducted to overcome the shortcomings of conventional DRAM. The hybrid memory cube (HMC) is one of the most promising 3D-stacked DRAMs, thanks to its high bandwidth and expandable structure. However, a high-speed serial link that interfaces the CPU and HMC consumes significant power, primarily because of the high overhead incurred in synchronising its clock. Although the link provides low-power modes, managing them is very difficult because of their long mode transition times. An autonomous power management method for the high-speed link is proposed. The proposed method determines the optimal number of active links while satisfying the required link performance. Simulations demonstrate that the proposed method reduces link power consumption by an average of 63.06% with a performance degradation of only 1.36%. Therefore, this proposed autonomous link power management is an outstanding option for low-power HMC-based systems.

키워드

power consumptionDRAM chipspower aware computingthree-dimensional integrated circuitssynchronisationautonomous high-speed serial link power management3D-stacked dynamic RAMsconventional DRAMhybrid memory cube3D-stacked DRAMslow-power modeslong mode transition timeshigh-speed linkactive linkslink performanceclock synchronisationlink power consumption reductionlow-power HMC-based systemCPU
제목
Autonomous high-speed serial link power management depending on required link performance for HMC
저자
Jeon, D. -I.Chung, Ki Seok
DOI
10.1049/el.2018.0997
발행일
2018-07
유형
Article
저널명
Electronics Letters
54
15
페이지
932 ~ 934