상세 보기
Structural decomposition of technological domain using patent co-classification and classification hierarchy
- Mun, Changbae;
- Yoon, Sejun;
- Park, Hyunseok
WEB OF SCIENCE
26SCOPUS
28초록
This paper proposes a new method for decomposing a technological domain (TD). Specifically, the method identifies sub-TDs at the different levels of technological hierarchy within the TD based on the characteristics of patent co-classification and classification hierarchy. We defined the smallest class, named Minimum Overlapped Class (MOC), constructed by overlaps of sub-group IPC(s) and sub-class UPC(s), and sub-TD is basically identified as a set of the MOCs. In order to cluster the MOCs, technological distances among MOCs are calculated based on patent co-classification and hierarchical structure of patent classification systems. Technologically similar MOCs are grouped by using a hierarchical clustering and the identified clusters at the different level of hierarchy show the hierarchical structure of a TD. Detailed technological content for each sub-TD is represented by extracting representative keywords through a text-mining technique. The method is empirically tested by the solar photovoltaic technology and the results show that the identified sub-TDs are reasonably acceptable by qualitative analysis.
키워드
- 제목
- Structural decomposition of technological domain using patent co-classification and classification hierarchy
- 저자
- Mun, Changbae; Yoon, Sejun; Park, Hyunseok
- 발행일
- 2019-11
- 유형
- Article
- 저널명
- Scientometrics
- 권
- 121
- 호
- 2
- 페이지
- 633 ~ 652