Application of photo-imageable thick film technology on zero-shrinkage LTCC tapes

초록

Photo-imageable thick film dielectrics and silver pastes were fabricated for fine patterning of via-holes and striplines. The patterned via-hole sizes of dielectric layer are ranging 50 ∼ 100um and line and space of silver conductor are 25 ∼ 75um. The photo-imageable conductor and dielectric thick films was screen printed on the LTCC green sheet. It was found that the patterning quality and resolution were influenced by the solid materials, lithography process conditions, and substrate materials. The efforts to improve patterning performance were provided. The materials adjustment for shrinkage matching during firing process to avoid camber generation was explored. The photo-imageable films are applied on two kinds of LTCC substrate green sheets; common LTCC green tapes and zero-shrinkage tapes. The influence of photo-imageable films on the zero-shrinkage tape was investigated.

키워드