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Effect of Organic Amine in Colloidal Silica Slurry on Polishing-Rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization

  • 박재근
제목
Effect of Organic Amine in Colloidal Silica Slurry on Polishing-Rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization
저자
박재근
발행일
2008-05-20
학회명
213th ECS Meeting
개최지
Phoenix Convention Center(USA)

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