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- 제목
- Interfacial Reaction of Sn-3.0Ag-0.5Cu solder with sputtered Ni-Zn under bump metallurgy during soldering and aging
- 저자
- 김영호
- 발행일
- 2010-11-23
- 학회명
- ENGE2010, international conference on Electronic Materials and Nanotechnology for Green Environment
- 개최지
- Jeju island, Korea