Effect of the hydroxyl-ethyl-cellulose concentration in a silicon wafer polishing slurry on the wafer surface roughness

초록

The purpose of this study was to reveal the mechanism of wafer touch polishing using a high-purity colloidal silica slurry containing organic surfactants such as hydroxyl-ethyl cellulose. The effect of the surfactant concentration on wafer touch polishing was studied to improve the roughness of wafer surfaces after polishing. The haze level and the micro-roughness decreased with decreasing surfactant concentration.

키워드