ScholarWorks@한양대학교

상세 보기

Development of an Advanced Bendable FPCB Materials and Multilayer Process for the Application of Flexible Electronics

  • 김영호
제목
Development of an Advanced Bendable FPCB Materials and Multilayer Process for the Application of Flexible Electronics
저자
김영호
발행일
2013-10-07
학회명
EMAP 2013 (15th International Conference On Electronic Materials and Packaging)
개최지
일산 KINTEX

ScholarWorks@한양대학교

(04763) 서울특별시 성동구 왕십리로 222 Tel. +82-2-2220-1370 +82-2-2220-1366

COPYRIGHT © 한양대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.