Enhanced electrical and electromagnetic interference shielding properties of uniformly dispersed carbon nanotubes filled composite films via solvent-free process using ring-opening polymerization of cyclic butylene terephthalate

  • Jang, Ji-un
  • Cha, Ji Eun
  • Lee, Seung Hwan
  • Kim, Jaewoo
  • Yang, Beomjoo
  • 외 2명
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초록

In order to develop a nanocomposite film based on multi-walled carbon nanotubes (MWCNTs) as an electromagnetic wave shielding material, we propose a solvent-free melting process for fabricating highly dispersed MWCNT-filled polymer composite films with high electrical conductivity and electromagnetic interference (EMI)-shielding properties. By observing aggregates (particles larger than 0.7 mu m) using X-ray micro-computed tomography (micro-CT), the uniform dispersion of the MWCNT fillers in the composite films was confirmed. Furthermore, the electrical conductivity and EMI shielding effectiveness (SE) values calculated using percolation and Simon's equations, respectively, were confirmed to agree with experimental data, indicating excellent MWCNT dispersion. The fabricated composites exhibited excellent electrical conductivity, EMI SE, and EMI specific SE (SSE) values of 4.33 S/cm, 30 dB, and of 24.8 dBcm(3)g(-1), respectively, and the EMI SSE value was as good as metal levels. The proposed solvent-free process can be contributed to the commercialization of EMI SE composite films based on MWCNTs.

키워드

Cyclic butylene terephthalateCompositeCarbon nanotubeIN-SITU POLYMERIZATIONCHEMICAL OXIDATIVE POLYMERIZATIONTHERMAL-CONDUCTIVITYTHEORETICAL APPROACHFACILE SYNTHESISNANOCOMPOSITESGRAPHITEGRAPHENEMATRIXFUNCTIONALIZATION
제목
Enhanced electrical and electromagnetic interference shielding properties of uniformly dispersed carbon nanotubes filled composite films via solvent-free process using ring-opening polymerization of cyclic butylene terephthalate
저자
Jang, Ji-unCha, Ji EunLee, Seung HwanKim, JaewooYang, BeomjooKim, Seong YunKim, Seong Hun
DOI
10.1016/j.polymer.2019.122030
발행일
2020-01
유형
Article
저널명
Polymer
186
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