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Effects of Abrasive Size and Molecular Weight of Poly(acrylic-acid) in Ceria Slurry on Pattern Density and Removal Selectivity of SiO2/SiN4 Films in STI CMP

  • 박재근
제목
Effects of Abrasive Size and Molecular Weight of Poly(acrylic-acid) in Ceria Slurry on Pattern Density and Removal Selectivity of SiO2/SiN4 Films in STI CMP
저자
박재근
발행일
2007-04-19
학회명
한국물리학회 2007년 봄 학술논문발표회
개최지
휘닉스파크

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