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초록
The low temperature and ultra fine pitch Chip on Glass (COG) bonding using non-conductive adhesive (NCA) was developed. 30 μm pitch Sn bumps on Si chip were bonded with the metal pads on the glass substrate at 80 °C. Reflowed Sn bumps were used to reduce the NCA trapping. The initial contact resistance of the bump joints at 80 MPa pressure was less than 30 mΩ, which was lower than that of the joints using anisotropy conductive film (ACF). Aging treatment at 85°C slightly decreased the contact resistance. Failed COG joints were not observed before and after aging.
키워드
Adhesives; Conductive films; Flip chip devices; Low temperature effects; Wafer bonding; Anisotropy conductive films; Non-conductive adhesives; Soldered joints
- 제목
- Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology
- 저자
- Kim, Soo Yeol; Oh, Tae-Sung; Lee, Won Jong; Kim, Young Ho
- 발행일
- 2006-08
- 유형
- Conference Paper
- 저널명
- 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
- 페이지
- 1 ~ 4