A method for wafer assignment in semiconductor wafer fabrication considering both quality and productivity perspectives

  • Lee, Dong-Hee
  • Lee, Chang-Ho
  • Choi, Seung-Hyun
  • Kim, Kwang-Jae
Citations

WEB OF SCIENCE

29
Citations

SCOPUS

29

초록

In the semiconductor wafer fabrication process, wafers go through a series of sequential process steps. Typically, each process step has several machines, and the wafers are assigned to one whenever they enter the process step. When assigning wafers to machines, it is important to consider both the quality and productivity perspectives. Major semiconductor companies in Korea have recently implemented a wafer assignment system to improve wafer yield, a critical measure for semiconductor quality. This system, however, does not consider the productivity perspective. This paper presents a systematic method for assigning wafers to maximize the wafer yield while satisfying a predetermined target level of productivity. A simple hypothetical example is presented to illustrate the method.

키워드

Emiconductor manufactureSchedulingProcess optimizationYield managementProductivity and quality integrationQuality engineeringSCHEDULING APPROACHDISPATCHING RULEJOB RELEASEOPTIMIZATIONSHOP
제목
A method for wafer assignment in semiconductor wafer fabrication considering both quality and productivity perspectives
저자
Lee, Dong-HeeLee, Chang-HoChoi, Seung-HyunKim, Kwang-Jae
DOI
10.1016/j.jmsy.2019.05.006
발행일
2019-07
유형
Article
저널명
Journal of Manufacturing Systems
52
페이지
23 ~ 31