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Electroplating of copper with conductive nanomaterials for enhanced TSV reliability
- 제목
- Electroplating of copper with conductive nanomaterials for enhanced TSV reliability
- 저자
- 소홍윤
- 발행일
- 2025-11-06
- 학회명
- The 23rd International Symposium on Microelectronics and Packaging (ISMP 2025)
- 개최지
- 바르미 호텔 인터불고 대구