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- 제목
- Development of ultra fine pitch Chip-on-Glass (COG) bonding with metal bumps having insulating layer in the side wall using Anisotropic conductive Adhesives (ACAs)
- 저자
- 김영호
- 발행일
- 2010-11-23
- 학회명
- ENGE2010, international conference on Electronic Materials and Nanotechnology for Green Environment
- 개최지
- Jeju island, Korea