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Effect of ozone concentration on atomic layer deposited HfO2 on Si
- Chung, K.J.;
- Park, T.J.;
- Sivasubramani, P.;
- Kim, J.;
- Ahn, J.
SCOPUS
3초록
Effect of ozone concentration (200-400 g/Nm3) on atomic layer deposition of HfO2 thin films on Si wafers using tetrakis (dimethylamino)hafhium (TDMAHf) as Hf precursor was systematically studied. High-resolution transmission electron microscopy and x-ray photoelectron spectroscopy analyses show that oxidation of the Si substrate enhances with ozone concentration which leads to an increase in interfacial layer (TL) thickness between the high-k dielectric and the substrate. The relatively thicker IL successfully suppresses additional growth of itself and Si out-diffusion into the dielectric during post deposition annealing (PDA). Corresponding electrical characteristics such as capacitance-voltage, leakage current density and time zero dielectric breakdown display significant improvement for HfO2 film prepared using higher ozone concentration after PDA.
키워드
- 제목
- Effect of ozone concentration on atomic layer deposited HfO2 on Si
- 저자
- Chung, K.J.; Park, T.J.; Sivasubramani, P.; Kim, J.; Ahn, J.
- 발행일
- 2010-00
- 유형
- Conference Paper
- 저널명
- ECS Transactions
- 권
- 28
- 호
- 1
- 페이지
- 221 ~ 226