Effect of ozone concentration on atomic layer deposited HfO2 on Si

  • Chung, K.J.
  • Park, T.J.
  • Sivasubramani, P.
  • Kim, J.
  • Ahn, J.
Citations

SCOPUS

3

초록

Effect of ozone concentration (200-400 g/Nm3) on atomic layer deposition of HfO2 thin films on Si wafers using tetrakis (dimethylamino)hafhium (TDMAHf) as Hf precursor was systematically studied. High-resolution transmission electron microscopy and x-ray photoelectron spectroscopy analyses show that oxidation of the Si substrate enhances with ozone concentration which leads to an increase in interfacial layer (TL) thickness between the high-k dielectric and the substrate. The relatively thicker IL successfully suppresses additional growth of itself and Si out-diffusion into the dielectric during post deposition annealing (PDA). Corresponding electrical characteristics such as capacitance-voltage, leakage current density and time zero dielectric breakdown display significant improvement for HfO2 film prepared using higher ozone concentration after PDA.

키워드

Atomic layer depositedCapacitance voltageElectrical characteristicHigh-k dielectricInterfacial layerOut-diffusionOzone concentrationPost deposition annealingSi substratesSi waferTetrakisTime-zero dielectric breakdownsAtomic layer depositionConcentration (process)Current voltage characteristicsHafniumHafnium compoundsHigh resolution transmission electron microscopyLeakage currentsLogic gatesOzoneOzone layerSiliconSilicon wafersX ray photoelectron spectroscopySemiconducting silicon compounds
제목
Effect of ozone concentration on atomic layer deposited HfO2 on Si
저자
Chung, K.J.Park, T.J.Sivasubramani, P.Kim, J.Ahn, J.
DOI
10.1149/1.3375604
발행일
2010-00
유형
Conference Paper
저널명
ECS Transactions
28
1
페이지
221 ~ 226