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Effect of Solder Pad on the Fatigur Life of FBGA Memory Modules Under Harmonic Excitation by Using Global-Local Modeling Technique

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Effect of Solder Pad on the Fatigur Life of FBGA Memory Modules Under Harmonic Excitation by Using Global-Local Modeling Technique
저자
장건희
발행일
2011-05-26
학회명
K-J Symposium 2011
개최지
Busan, Korea

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