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Effect of pH in Colloidal Silica Slurry on Polishing Rate Selectivity of Nitrogen-doped Ge2Sb2Te5 to SiO2 in Chemical Mechanical Polishing

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Effect of pH in Colloidal Silica Slurry on Polishing Rate Selectivity of Nitrogen-doped Ge2Sb2Te5 to SiO2 in Chemical Mechanical Polishing
저자
박재근
발행일
2009-05-21
학회명
2009년도 한국재료학회 춘계학술발표대회 및 제 16회 신소재 심포지엄
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