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The effects of water-soluble organic additives on the rheological behavior of colloidal silica slurry and its influence on wafer polishing process
- 제목
- The effects of water-soluble organic additives on the rheological behavior of colloidal silica slurry and its influence on wafer polishing process
- 저자
- 백운규
- 발행일
- 2004-06-04
- 학회명
- International conference on crystal growth and LED Epi and substrate
- 개최지
- 성균관대학교