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초록
We developed a reliable and ultra-fine pitch chip on glass (COG) bonding technique using non-conductive adhesive (NCA). Sn was used as a bump material because it has a high plastic deformation capability and it is cheaper than an Au bump. Sn bumps were formed using photolithographic and electroplating and reflowed to form the half-dome shape. Reflowed Sn bumps were used to reduce the NCA trapping. COG bonding was performed between the reflowed Sn/Cu bumps on the SiO2/Si wafer and ITO/Au/Cu/Ti/ glass substrate at 150°C by using a thermo-compression bonder. The bonded specimens were subjected to reliability test.
키워드
ABS resins; Flip chip devices; Gold; Photoresists; Silicon compounds; Tin; Electronic Materials and Packaging; International conferences; Non-conductive adhesive; Glass bonding
- 제목
- The reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive
- 저자
- Kim, Byeung Gee; Lee, Sang Mok; Kim,Young Ho
- 발행일
- 2007-11
- 유형
- Conference Paper
- 저널명
- EMAP 2007 - International Conference on Electronic Materials and Packaging 2007
- 페이지
- 1 ~ 3