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Bonding Based Channel Transfer and Low Temperature Process for Monolithic 3D Integration Platform Development
- 제목
- Bonding Based Channel Transfer and Low Temperature Process for Monolithic 3D Integration Platform Development
- 저자
- 최창환
- 발행일
- 2016-10-13
- 학회명
- IEEE S3S (SOI-3D-Subthreshold Microelectronic Technology Unified) Conference
- 개최지
- Burlingame, USA