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Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo- Sensor Circuits
- 제목
- Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo- Sensor Circuits
- 저자
- 최창환
- 발행일
- 2021-06-30
- 학회명
- 대한전자공학회 하계학술대회
- 개최지
- 롯데호텔 제주 (중문)