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Improvement of assembly reliability by optimization of pad design on printed circuit board
- 제목
- Improvement of assembly reliability by optimization of pad design on printed circuit board
- 저자
- 김학성
- 발행일
- 2022-11-10
- 학회명
- ISMP 2022 (International Symposium on Microelectronics and Packaging)
- 개최지
- 부산, 한화 리조트