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자료 필터
자료유형
발행연도
2010 ~ 2026
2010 2026
키워드
언어
전체 750건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Anisotropic viscoelastic properties of prepreg and their influence on warpage of thin PCB substrates
- Kumar, Sanjay ;
- Yoo, Woong-Kyoo ;
- Kim, Jaesung ;
- Ahn, Chae-Young ;
- Kim, Jinwoong ;
- ... Kim, Hak-Sung ;
- 외 1명
- 2026-12
- Composites Part A: Applied Science and Manufacturing
- Elsevier Ltd
Article
Decoupling PEG and chloride co-adsorption kinetics at copper/electrolyte interface during pattern-dependent electrodeposition
- Cho, Sangmin ;
- Park, Jeongwoo ;
- Park, Sangmin ;
- Seol, Yulim ;
- Shim, Jihye ;
- ... Kim, Hak-Sung ;
- ... So, Hongyun
- 2026-11
- Applied Surface Science
- Elsevier BV
Article
Integrated electrochemical characterization and finite element modeling for optimizing copper filling in through-glass Vias: Kinetic parameter extraction and profile prediction
- Kim, Young-Woo ;
- Baek, Jeong-Hyeon ;
- Lee, Se-Min ;
- Park, Jong-Whi ;
- Lee, Ho-Jin ;
- ... So, Hong-Yun ;
- ... Kim, Hak-Sung ;
- 외 2명
- 2026-09
- Journal of Electroanalytical Chemistry
- Elsevier BV
Article
Multi-physics coupled modeling of process-induced warpage in advanced fan-out wafer-level semiconductor packages
- Baek, Jeong-Hyeon ;
- Song, Jun-Seop ;
- Yoo, Woong-Kyoo ;
- An, Woo-Jin ;
- Oh, Gyung-Hwan ;
- ... Kim, Hak-Sung
- 2026-09
- Journal of Manufacturing Processes
- ELSEVIER SCI LTD
Article
Dry plasma-enhanced adhesion of Ti/Cu seed layers to ABF substrates for fine-pitch packaging reliability
- Lee, Se-Min ;
- Um, Hui-Jin ;
- Jeon, Na-Hyun ;
- Rho, Hyun-Ji ;
- Jeong, Soon-Oh ;
- ... Kim, Hak-Sung ;
- 외 2명
- 2026-08
- Applied Surface Science
- Elsevier BV
Article
Influence of mechanical pre-strain under varying temperatures on flexural performance and failure of 3D-printed carbon fiber sandwich structures
- Kumar, Sanjay ;
- Kim, Hak-Sung
- 2026-07
- Composite Structures
- ELSEVIER SCI LTD
Conference
Optimization of Thermo-Compression Bonding Process and Reliability test of Self-assembly Anisotropic Conductive Adhesive for Fine Pitch Interconnections
- 2026-06-26
Conference
Influence of Anisotropic Thermo-Viscoelastic Behavior of Woven Prepregs on Warpage in Ultra-Thin PCB Substrates
- 2026-06-25