STUDY ON CURE SHRINKAGE OF EMC USING DIELECTRIC SENSOR AND FBG SENSOR

Baek, Jeong-Hyeon; Park, Dong-Woon; Park, Simon; Kim, Hak Sung

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STUDY ON CURE SHRINKAGE OF EMC USING DIELECTRIC SENSOR AND FBG SENSOR

Baek, Jeong-Hyeon;
Park, Dong-Woon;
Park, Simon;
Kim, Hak Sung

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초록

The curing status and internal strain of epoxy molding compound (EMC) were monitored using a dielectric sensor and a fiber Bragg grating (FBG) sensor under curing conditions similar to the actual semiconductor packaging process. The dissipation factor was measured with a dielectric sensor during the molding process, and a gelation point, which is the starting point of effective cure shrinkage, was defined. Also, differential scanning calorimetry (DSC) test and rheometer test were performed and analyzed with dielectrometry measurement. In addition, Bragg wavelength (BW) was measured with the FBG sensor during the whole curing process and the cure shrinkage of the EMC was obtained. From these results, the effective cure shrinkage of the EMC that actually affects the residual stress of the EMC after curing processing was obtained.

키워드

Cure shrinkage; Dielectric sensor; EMC; FBG sensor; Gelation point; Curing; Dielectric devices; Electric sensing devices; Electromagnetic compatibility; Fiber Bragg gratings; Gelation; Molding; Shrinkage; Differential scanning calorimetry; A.Fibres; Cure shrinkage; Curing condition; Dielectric fibers; Dielectric sensors; Epoxy molding compounds; Fiber Bragg Grating Sensors; Gelation point; Internal strains; Semiconductor packaging

제목: STUDY ON CURE SHRINKAGE OF EMC USING DIELECTRIC SENSOR AND FBG SENSOR

저자: Baek, Jeong-Hyeon; Park, Dong-Woon; Park, Simon; Kim, Hak Sung

발행일: 2022-06

유형: Conference Paper

저널명: ECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability

권: 1

페이지: 1557 ~ 1564