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High Fidelity Reliability Prediction of SAC Solder Under Drop Impact via High Strain Rate and Temperature Dependent Properties
- 제목
- High Fidelity Reliability Prediction of SAC Solder Under Drop Impact via High Strain Rate and Temperature Dependent Properties
- 저자
- 김학성
- 발행일
- 2026-05-29
- 학회명
- The 2026 IEEE 76th Electronic Components and Technology Conference
- 개최지
- JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida, USA