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Hydrogen Ion Implantation-Based Wafer Bonding with Low Blister Formation Temperature (˂450oC) for M3D Integration
- 제목
- Hydrogen Ion Implantation-Based Wafer Bonding with Low Blister Formation Temperature (˂450oC) for M3D Integration
- 저자
- 최창환
- 발행일
- 2017-11-08
- 학회명
- International Microprocesses and Nanotechnology Conference
- 개최지
- Jeju, Korea