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Development of Multiple Redistribution Layer (RDL) Using FEOL photolithography Toward 2.xD Packaging Technology
- 제목
- Development of Multiple Redistribution Layer (RDL) Using FEOL photolithography Toward 2.xD Packaging Technology
- 저자
- 최창환
- 발행일
- 2024-01-18
- 학회명
- NANO CONVERGENCE CONFERENCE(NCC) 2024
- 개최지
- 대전컨벤션센터