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Prediction of crack type and life of printed circuit board under thermal cycling with respect to solder composition
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- Prediction of crack type and life of printed circuit board under thermal cycling with respect to solder composition
- 저자
- 김학성
- 발행일
- 2023-03-09
- 학회명
- IEEE EDTM 2023
- 개최지
- COEX, SEOUL, KOREA