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Study of Reliability of Redistribution Layers in Advanced Packaging: Electrochemical Migration Analysis and Parametric Electrochemical Modeling
- 제목
- Study of Reliability of Redistribution Layers in Advanced Packaging: Electrochemical Migration Analysis and Parametric Electrochemical Modeling
- 저자
- 김학성
- 발행일
- 2025-11-12
- 학회명
- The 4th Korean International Semiconductor Conference & Exhibition on Manufacturing Technology
- 개최지
- 파라다이스호텔, 부산