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Warpage simulation of bi-material strip by the effective cure shrinkage measurement of EMC using dielectric and FBG sensors
- 제목
- Warpage simulation of bi-material strip by the effective cure shrinkage measurement of EMC using dielectric and FBG sensors
- 저자
- 김학성
- 발행일
- 2022-11-10
- 학회명
- ISMP 2022 (International Symposium on Microelectronics and Packaging)
- 개최지
- 부산, 한화 리조트