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Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
- 제목
- Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
- 저자
- 김학성
- 발행일
- 2026-05-29
- 학회명
- 2026 한국반도체디스플레이기술학회 국내학술대회
- 개최지
- 가천대학교 글로벌캠퍼스, 성남