상세 보기
Advanced Flip-chip Bonding Process via Intense Pulsed Light Irradiation: From Single-Chip to Multi-Chip Stacking Applications
- 제목
- Advanced Flip-chip Bonding Process via Intense Pulsed Light Irradiation: From Single-Chip to Multi-Chip Stacking Applications
- 저자
- 김학성
- 발행일
- 2025-11-11
- 학회명
- The 4th Korean International Semiconductor Conference & Exhibition on Manufacturing Technology
- 개최지
- 파라다이스호텔, 부산