Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations

  • Jang, Yongrae
  • Yang, Yu-Hsiang
  • Han, Bongtae
  • Kim, You-Gwon
  • Kim, Hak-Sung

초록

Reliability of SAC-LTS hybrid joints is assessed. Two tasks are conducted to achieve the goal. The first task involves determination of the Bi concentration dependent constitutive properties. A simple solder assembly is fabricated to examine the distribution of Bi concentration within a hybrid solder joint. Based on the distribution results, specimens with known Bi concentrations are fabricated and tested at various temperatures to obtain the constants of the Anand model as a function of Bi concentration. In the second task, an FEM model is developed to simulate various layers with different Bi concentrations in the hybrid joint. The well-known energy-based fatigue model is implemented to predict the cycles to failure. The prediction is compared with actual thermal shock testing data, and the results are discussed.

제목
Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations
저자
Jang, YongraeYang, Yu-HsiangHan, BongtaeKim, You-GwonKim, Hak-Sung
DOI
10.1109/ECTC51909.2023.00343
발행일
2023-06-01
학회명
2023 IEEE 73rd IEEE Electronic Components and Technology Conference, ECTC 2023
개최지
Orlando, FL, USA
개최국가
미국
학회 개최일
2023-05-30 ~ 2023-06-02