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Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations
- Jang, Yongrae;
- Yang, Yu-Hsiang;
- Han, Bongtae;
- Kim, You-Gwon;
- Kim, Hak-Sung
초록
Reliability of SAC-LTS hybrid joints is assessed. Two tasks are conducted to achieve the goal. The first task involves determination of the Bi concentration dependent constitutive properties. A simple solder assembly is fabricated to examine the distribution of Bi concentration within a hybrid solder joint. Based on the distribution results, specimens with known Bi concentrations are fabricated and tested at various temperatures to obtain the constants of the Anand model as a function of Bi concentration. In the second task, an FEM model is developed to simulate various layers with different Bi concentrations in the hybrid joint. The well-known energy-based fatigue model is implemented to predict the cycles to failure. The prediction is compared with actual thermal shock testing data, and the results are discussed.
- 제목
- Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations
- 저자
- Jang, Yongrae; Yang, Yu-Hsiang; Han, Bongtae; Kim, You-Gwon; Kim, Hak-Sung
- 발행일
- 2023-06-01
- 학회명
- 2023 IEEE 73rd IEEE Electronic Components and Technology Conference, ECTC 2023
- 개최지
- Orlando, FL, USA
- 개최국가
- 미국
- 학회 개최일
- 2023-05-30 ~ 2023-06-02