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Thermo-Compression Flipchip Interconnection using Plasma Enhanced Copper Organic Solderability Preservative Etched Substrate

제목
Thermo-Compression Flipchip Interconnection using Plasma Enhanced Copper Organic Solderability Preservative Etched Substrate
저자
정진욱
발행일
2013-11-18
학회명
International Conference on Surface Engineering 2013
개최지
Busan

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