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Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits
- 제목
- Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits
- 저자
- 최창환
- 발행일
- 2020-12-15
- 학회명
- IEEE International Electron Devices Meeting (IEDM)
- 개최지
- Virtual Conference