상세 보기
FEA-Integrated 3PB And BOR Testing For Fracture Strength Characterization Of Ultra-thin Dies: Effects Of Thickness, Surface Conditions, And Anisotropy
- 제목
- FEA-Integrated 3PB And BOR Testing For Fracture Strength Characterization Of Ultra-thin Dies: Effects Of Thickness, Surface Conditions, And Anisotropy
- 저자
- 김학성
- 발행일
- 2026-05-27
- 학회명
- The 2026 IEEE 76th Electronic Components and Technology Conference
- 개최지
- JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida, USA