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Enhancing Solder Joint Reliability through advanced solder with Bi, Ni, and Pd: A Comparative Study of Creep properties, IMC Suppression, and Mechanical Properties.
- 제목
- Enhancing Solder Joint Reliability through advanced solder with Bi, Ni, and Pd: A Comparative Study of Creep properties, IMC Suppression, and Mechanical Properties.
- 저자
- 김학성
- 발행일
- 2024-06-26
- 학회명
- 대한기계학회 춘계학술대회