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Warpage Prediction of PCB in Multi-Laminating Processes Considering Cure Shrinkage and Anisotropic Visco-Elastic Properties of Prepreg Core
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- Warpage Prediction of PCB in Multi-Laminating Processes Considering Cure Shrinkage and Anisotropic Visco-Elastic Properties of Prepreg Core
- 저자
- 김학성
- 발행일
- 2026-05-29
- 학회명
- The 2026 IEEE 76th Electronic Components and Technology Conference
- 개최지
- JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida, USA