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Derivation of Representative Creep Properties for Accurate Thermal Fatigue Life Prediction in SAC305 Solder Joints through Grain and Microstructure Control
- 제목
- Derivation of Representative Creep Properties for Accurate Thermal Fatigue Life Prediction in SAC305 Solder Joints through Grain and Microstructure Control
- 저자
- 김학성
- 발행일
- 2024-05-30
- 학회명
- 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)