Etching characteristics of photoresist and low-k dielectrics by Ar/O-2 ferrite-core inductively coupled plasmas

  • Kim, Hyoun Woo
  • Lee, Jong Woo
  • Hwang, Woon Suk
  • Beom, Hoan O.
  • Lee, Seung Gol
  • ... Chung, Chin Wook
  • 외 17명
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초록

We have investigated the characteristics of Ar/O-2 plasmas in terms of the photoresist (PR) and low-k material etching using a ferrite-core inductively coupled plasma (ICP) etcher. We found that the O-2/(O-2+Ar) gas flow ratio significantly affected the PR etching rate and the PR to low-k material etch selectivity. Fourier transform infrared spectroscopy (FTIR) and HF dipping test indicated that the etching damage to the low-k material decreased with decreasing O-2/(O-2+Ar) gas flow ratio.

키워드

photoresistlow-k materialICPMETHYLSILSESQUIOXANE
제목
Etching characteristics of photoresist and low-k dielectrics by Ar/O-2 ferrite-core inductively coupled plasmas
저자
Kim, Hyoun WooLee, Jong WooHwang, Woon SukBeom, Hoan O.Lee, Seung GolPark, Se-GeunKim, JooheeChung, Duck JinChang, Sung PilJoo, Young-ChangJoo, JunghoonChung, Chin WookPark, Wan JaeKang, Chang-JinJoo, SukhoPark, Soon OhYoo, Chung-GonKim, Sung KyeongLee, Joung HoCho, Sang-DeogChoi, Dae-KyuKim, KeehoJang, Jeong-Yeol
DOI
10.1016/j.mee.2007.06.016
발행일
2008-02
유형
Article
저널명
Microelectronic Engineering
85
2
페이지
300 ~ 303