Integrated electrochemical characterization and finite element modeling for optimizing copper filling in through-glass Vias: Kinetic parameter extraction and profile prediction

초록

Simulation-based approach for predicting copper filling behavior in Through-Glass Vias (TGV) based on the effects of electrolyte additives was developed to enable accurate analysis and optimization of via filling performance. Electrochemical characterization of additive-controlled charge transfer and mass transport characteristics in the electrolyte was performed using Linear Sweep Voltammetry (LSV) and Chronoamperometry (CA) to derive key electroplating parameters, including charge transfer coefficient, reaction rate constant, and diffusion coefficient, for different additive concentrations. An electroplating finite element model was constructed, employing the derived kinetic and transport parameters as input values to evaluate how variations in additive compositions influence via-filling characteristics, including filling morphology, void formation, and deposition thickness near via opening. The predicted filling profile was validated by cross-sectional analysis using optical microscopy (OM). Based on the developed simulation model, optimized additive compositions were identified. This integrated experimental-simulation method offers a quantitative approach for optimizing TGV electroplating, establishing a solid basis for enhancing filling reliability in next-generation 2.5D/3D interconnect techniques.

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