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Solder Composition Impact on Crack Type Prediction and Fatigue Life in Repeated Thermal Cycling of Printed Circuit Boards
- 제목
- Solder Composition Impact on Crack Type Prediction and Fatigue Life in Repeated Thermal Cycling of Printed Circuit Boards
- 저자
- 김학성
- 발행일
- 2023-10-26
- 학회명
- ISMP 2023
- 개최지
- Paradise Hotel Busan, korea