상세 보기
Detection of micro-defects inside integrated circuit packages training terahertz signals based on convolutional neural network
- 제목
- Detection of micro-defects inside integrated circuit packages training terahertz signals based on convolutional neural network
- 저자
- 김학성
- 발행일
- 2022-11-11
- 학회명
- ISMP 2022 (International Symposium on Microelectronics and Packaging)
- 개최지
- 부산, 한화 리조트