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Monolithic 3D Integration Process and Its Device Applications
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1초록
We have demonstrated the monolithic 3D integration (M3D) process and its applications to hybrid CMOS and photodiode device system as well as 3D neuromorphic device system. This M3D process was realized by both hydrogen ion (H+) implantation and Silicon-on-Insulator (SOI) wafer bonding with optimized various unit processes. Our result indicate that M3D integration process can be an alternative process integration scheme to the conventional 2D scaling process.
키워드
Ion Implantation; Monolithic 3D Integration (M3D); Wafer Bonding; Ion implantation; Monolithic integrated circuits; Silicon on insulator technology; Silicon wafers; Three dimensional integrated circuits; Wafer bonding; 3-D integration; Device application; Device system; Hybrid photodiodes; Integration process; Ions implantation; ITS applications; Monolithic 3d integration; Monolithics; Process applications
- 제목
- Monolithic 3D Integration Process and Its Device Applications
- 저자
- Choi, Chang hwan
- 발행일
- 2022-03
- 유형
- Proceedings Paper
- 저널명
- 6TH IEEE ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2022)
- 페이지
- 76 ~ 78
- 언어
- ENG
- 출판사
- IEEE
- 발행국가
- 미국
- 분량
- 3 페이지