Electrical test method using high density plasmas for high-end printed circuit boards

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초록

A novel electrical test method that uses high-density plasmas, such as inductively coupled discharges, is proposed to detect open/short failures of high-end printed circuit boards (PCBs). The PCB is inserted into the plasma chamber with the top side facing the plasma sheath, and the bottom of the PCB is connected to the probe pin for the dc voltage bias and current measurements. A failure, including a latent open, can be precisely detected by biasing the dc voltage near the plasma potential due to the specific characteristics of the sheath formed on the PCB surface.

키워드

Electric dischargesElectric insulation testingElectromagnetic inductionOrganic pollutantsPlasma sheathsPolychlorinated biphenylsPrinted circuit boardsDC voltageElectrical testsHigh density plasmasInductively coupled dischargePlasma chambersPlasma potential
제목
Electrical test method using high density plasmas for high-end printed circuit boards
저자
Oh, Se-JinKim, Young-CheolChung, Chin-Wook
DOI
10.1063/1.3676162
발행일
2012-01
유형
Article
저널명
Review of Scientific Instruments
83
1
페이지
1 ~ 4