상세 보기
Prediction of crack type and fatigue life of printed circuit board with respect to solder composition under repeated thermal cycle
- 제목
- Prediction of crack type and fatigue life of printed circuit board with respect to solder composition under repeated thermal cycle
- 저자
- 김학성
- 발행일
- 2022-11-11
- 학회명
- ISMP 2022 (International Symposium on Microelectronics and Packaging)
- 개최지
- 부산, 한화 리조트