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Real time thickness measurement based on terahertz time-domain spectroscopy for chip-top epoxy molding compound in semiconductor package
- Oh, Gyung Hwan;
- Park, Dong Woon;
- Kim, Dug Joong;
- Kim, Hak Sung
Citations
SCOPUS
0초록
The refractive index and thickness of EMC were measured non-destructively using the terahertz time-domain spectroscopy (THz-TDS) system. A theoretical model was developed using an analysis of time response on transmission and reflection THz signals. Using this developed theoretical model, the refractive index of EMC was measured within 1% of the error range. Simultaneously, the thickness of EMC was calculated through the measured refractive index and induced time delay. As a result, the refractive index and thickness of EMC was measured within the error range of 0.9% and 3.0%, respectively.
키워드
Electronics packaging; Plasmons; Reflectometers; Refractive index; Spectrophotometers; Terahertz waves; Thickness measurement; Epoxy molding compounds; Error range; Real time; Semiconductor packages; Terahertz time domain spectroscopy; Theoretical modeling; THz signal; Terahertz spectroscopy
- 제목
- Real time thickness measurement based on terahertz time-domain spectroscopy for chip-top epoxy molding compound in semiconductor package
- 저자
- Oh, Gyung Hwan; Park, Dong Woon; Kim, Dug Joong; Kim, Hak Sung
- 발행일
- 2018-10
- 유형
- Proceeding
- 저널명
- International Conference on Infrared, Millimeter, and Terahertz Waves, IRMMW-THz
- 권
- 2018
- 호
- September