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Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
- 제목
- Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
- 저자
- 김학성
- 발행일
- 2025-11-07
- 학회명
- The 23rd International Symposium on Microelectronics and Packaging
- 개최지
- 바르미 호텔 인터불고, 대구