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Wafer Layer Transfer for Monolithic 3D (M3D) Integration using SOI Substrate and Smart-Cut
- 제목
- Wafer Layer Transfer for Monolithic 3D (M3D) Integration using SOI Substrate and Smart-Cut
- 저자
- 최창환
- 발행일
- 2022-11-16
- 학회명
- Korean International Semiconductor Conference on Manufacturing Technology (KISM)
- 개최지
- 부산 파라다이스호텔