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Microelectronics
ISSN
P 0026-2692 E 1879-2391
출판사
Mackintosh Publications
국가
ENGLAND
발행 상태
비활성
데이터베이스 수록 정보
JCR 1997-2019 (23년)
SCIE 2010-2021 (12년)
Scopus 2017-2020 (4년)
SJR 1999-2019 (21년)
전체 23건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Materials and design strategies for interposer-based packaging: A comparative review of silicon, glass, and organic platforms
- Kim, Yonghyun ;
- Lee, Hoyoon ;
- Park, Jeongwoo ;
- Cho, Sangmin ;
- So, Hongyun
- 2026-09
- Materials and Design
- Elsevier Ltd
Article
Prediction and assessment of nanoprobe for tip-enhanced Raman spectroscopy: Data-driven artificial intelligence approach
- Suh, Hyeong Chan ;
- Kim, Taehoon ;
- Yi, Dong-Joon ;
- Kim, Dong Hyeon ;
- Kim, Sung Hyuk ;
- ... Jeong, Mun Seok ;
- 외 6명
- 2026-06
- Materials and Design
- ELSEVIER SCI LTD
Article
Wet-spun hybrid hydrogel fibers exhibiting high electrical and mechanical stability in flexible electronics
- Sinha, Animesh ;
- Kim, Junho ;
- Park, Sangyeun ;
- Koo, Doheon ;
- So, Hongyun
- 2026-02
- Materials and Design
- ELSEVIER SCI LTD
2025
Article
Effect of electroplating current density and post-annealing on the warpage and reliability of redistribution layer for advanced semiconductor package
- Kim, Taek-Hyeon ;
- Baek, Jeong-Hyeon ;
- Kim, Sang-Il ;
- Kim, Tae-Hoon ;
- Shim, Ji-Hye ;
- ... Kim, Hak-Sung
- 2025-11
- Materials and Design
- ELSEVIER SCI LTD
Article
Integrated design and validation of 3D radiant heater for electric vehicles: Thermo-Electrical finite element analysis considering strain-dependent resistance in thermo-forming
- Baek, Jeong-Hyeon ;
- Park, Tae-In ;
- Kim, Yoon-Jin ;
- Park, Ji-Sun ;
- Kim, Hak-Sung
- 2025-10
- Materials and Design
- ELSEVIER SCI LTD
Article
Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials
- Kim, Heon-Su ;
- Kim, You-Gwon ;
- Jang, Dong-Min ;
- Jang, Jin-Woo ;
- Lee, Seung-Yeong ;
- ... Kim, Hak-Sung
- 2025-06
- Materials and Design
- ELSEVIER SCI LTD
Article
Transforming Fe-Cu alloys with unprecedented BCC Cu precipitates toward dual mechanical functionalities
- Kim, Jeong Rae ;
- Kang, Hyun-Su ;
- Ko, Tae-Wan ;
- Hwang, Young Jae ;
- Kim, Gun Hee ;
- ... Choi, Seon-Jin ;
- 외 4명
- 2025-06
- Materials and Design
- ELSEVIER SCI LTD
Article
Microstructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structures
- Park, Sangyeun ;
- Chun, Byungkwon ;
- Kim, Sunbum ;
- Kim, Hak-Sung ;
- So, Hongyun
- 2025-04
- Materials and Design
- ELSEVIER SCI LTD
2024
Article
Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound
- Um, Hui-Jin ;
- Ju, Young-Min ;
- Lee, Dae-Woong ;
- Ahn, Jinho ;
- Kim, Hak-Sung
- 2024-09
- Materials and Design
- ELSEVIER SCI LTD
Article
A critical review on machine learning applications in fiber composites and nanocomposites: Towards a control loop in the chain of processes in industries
- Gomez-Flores, Allan ;
- Cho, Hyunjae ;
- Hong, Gilsang ;
- Nam, Hyojeong ;
- Kim, Hyunjung ;
- 외 1명
- 2024-09
- Materials and Design
- ELSEVIER SCI LTD
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